Info: +39 0125.71.96.23 – info@micromegael.com

Micro Mega Elettronica - Tecnologie avanzate al servizio dell'assemblaggio di piastre elettroniche - Advanced technologies for the assembly of electronic plates
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To be an efficient partner in the world of advanced electronics it is necessary to offer

experience, technical capability, flexibility

and fronting edge technologies.

This mixture becomes an added value for those Clients who understand they have a reliable and true partner to face the challenges of the global market with. In these latest years, MICRO MEGA has managed to become a leader on the sector of printed circuits assembly. Not only, it has offered a prompt and high quality service to important domestic and foreign brands also for small and medium-size batches.

OUR LATEST INVESTMENTS:

superwash
Selective Soldering in inert atmosphere
Saldatura SMT
SMT soldering
Saldatura VACUUM VAPOUR PHASE
VACUUM VAPOR PHASE welding
Ispezione Raggi X
X ray inspection
ispezione ottica 3D
Automatic Optic Inspection BF-3Di
superwash
SuperSwash washing system

In STRAMBINO, 30 KM from TURIN

Micro Mega owns a spacious and bright warehouse

situated a few kilometres from Ivrea

Saldatura Selettiva in atmosfera inerte
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Top-level

instrumentation

and professionalism

<- SELECTIVE WELDING MACHINE
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Automatic SMT assembling

lines for SMT boards

ASM SIPLACE ->
Rework weller bBGA
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Service of rework
ON BGA BGA, QPP, QFN

<-  REWORK BGA STATION
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Quality and reliability
they are elements
essential

FLYNG PROBES TEST SYSTEMS ->
Test a sonde mobili

PRODUCTS

Assembly lines which, through the automatic processes of screen printing, glue dispensing, assembly, remelting in an inert atmosphere, polymerization, all types of passive and active components are assembled:

EQUIPMENT

Assembly lines which, through the automatic processes of screen printing, glue dispensing, assembly, remelting in an inert atmosphere, polymerization, all types of passive and active components are assembled:

SERVICES

Assembly lines which, through the automatic processes of screen printing, glue dispensing, assembly, remelting in an inert atmosphere, polymerization, all types of passive and active components are assembled: